DIP Package Types:
Standard DIP configurations with various pin counts
Ceramic DIP packages for high-reliability applications
Plastic DIP packages for commercial use
Through-hole mounting characteristics
SMD Package Types:
SOIC (Small Outline Integrated Circuit) packages
TSOP (Thin Small Outline Package) configurations
QFP (Quad Flat Package) types
BGA (Ball Grid Array) packages
CSP (Chip Scale Package) solutions
Package Selection Considerations:
Manufacturing requirements and processes
Space constraints and density requirements
Performance and thermal management
Cost considerations for different applications